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    Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
    Cód:
    491_9781013279058

    Por: R$ 530,01ou X de

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    To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.This work was published by Saint Philip Street Press pursuant to a Creative Commons license permitting commercial use. All rights not granted by the works license are retained by the author or authors.
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