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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6
Cód:
491_9783030301002
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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:Test Design and Inverse Method AlgorithmsInverse Problems: Virtual Fields MethodResidual Stresses: Measurement, Uncertainty & ValidationResidual Stresses: Eigenvalues, Modeling, & Crack GrowthMaterial Characterizations Using ThermographyFatigue, Damage & Fracture Evaluation Using Infrared Thermography
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